Becomes sticky when cooled down to below the switching temperature. Adhesion releases when warmed up to above the switching temperature. Switching temperature can be set freely between 30 and 50ºC.
Warm-off type is suitable for applications where workpieces are fixed and processed at room temperature. Because the adhesion releases by warming and the tape does not damage works, the tape is suited for dicing electronic components and more.

HOW TO USE

• Peel the transparent PET separator from the tape. Since the tape is tacky at room temperature, affix it to the target location using a rubber roller, etc.
  Pass the rubber roller back and forth over the tape with little force 2 or 3 times.
  Pressing hard with the roller will keep the tape from peeling or may leave glue on the target surface.
• Use this tape for application at temperature below 50ºC.
• To peel the tape after the work, heat up the workpiece and tape to above 60ºC.
  Peel the tape off at 60ºC or higher temperature. If attempted below 60ºC,
  the adhesive force is still active, making it harder to peel the tape off.

DATA

PRECAUTIONS FOR USE

• Affixing the tape
  This tape is tacky at room temperature,but its adhesive force changes according to temperature,pressure and other factors. Therefore,test the tape before actual use.
• Peeling the tape
  This tape loses its tackiness at 60ºC and higher temperatures, but its release depends on bonding conditions, etc. Also note that peeling the tape below 60ºC can damage the target surface.

SPECIFICATION

Product code	Switching temp.	Tack strength＊2 （for stainless steel） N/25mm	Tack strength decreasing rate	Tape thickness （No separators）	Base （PET） thickness	Remarks
WS5130C02	50℃	6.0	＞90% at 60ºC	130μm	100μm	Single-sided type＊1 Highly condensed type
WS5130C10		1.5
WS5130C20		0.7
WS5030C15		0.3				Single-sided type＊1 Highly tacky type

＊1：Double-sided type also available.　＊2：Compliant with JIS Z0237

 

APPLICATION

● Warm-off tape applicable to various purposes

Eco-friendly tape that can be peeled by just changing the temperature.

● For wafer or device dicing	● As carrier tape for thin-film workpieces
Workpieces can be freely released by heating the tape Proposal for dicing application	Workpieces can be freely released by heating the tape Proposal for carrier application
● For device transfer process	● As masking tape for plating process
Workpieces can be easily transferred to other tape by heating the tape Proposal for transfer application	Using the WO Tape for plating operations protects workpieces against plating liquid in ltration. Once plating is complete, the tape can be easily peeled by heating it Proposal for masking application