Plafix
Heat resistance type of Cool-off Type
Affixes tightly in room temp.~200℃ and easily to peeled off in under 5℃.
Sticked over the switching temp.
Can be peeled off under the switching temp.
Acceptable use for carrier FPC.
Tack strength vs temperature
*Switching temperature : Temp. becomes tacky.
■ Specification
| Product name | Switching temp. | Tack strength at 50℃ (with polyimide) N/25mm*1 |
Tack strength at 5℃ (with polyimide) N/25mm*1 |
Glue thickness | Structure |
|---|---|---|---|---|---|
| CS2325NA4 | 25℃ | 1.4 | 0.05 | 25μm | Baseless type |
| CS2325NA2 | 25℃ | 0.4 | ＜0.05 | 25μm | Baseless type |
*1: 180℃-degree peel test with polyimide measured at 50℃ and 5℃. Complied with JIS Z0237.
*These values are actual measurements, and not guaranteed values.
Structure
Baseless type
*Can be customized to a single-sided or double-sided type.
Manufacturing Process of FPC
Temporary fixing process with glass seat enables manufacturing of flexible device that was not possible with existing glass line.
Plafix™ is resistant to all processes including flexible device manufacturing and can be peeled off without damaging the film-formed substrate after the process.
